A Quantitative SWOT analysis on Wafer Level Packaging Market 2022 major key companies profiled like Amkor Technology Inc., Fujitsu Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., Deca Technologies

Wafer level packaging (WLP) is a technology of packaging an integrated circuit where most or all of the packaging process steps are carried out at the wafer level in contrast to the conventional chip scale packaging and wire bonding. The advancements in wafer level packaging deliver highly efficient and reliable electrical interconnect solutions for electronic products. The market holds a great potential in electronics and IT & telecommunication industries.

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The leading electronic companies like Samsung, Intel and Apple incorporate these packages in their products. For instance, Apple is going to incorporate wafer level fan-out package for their next generation-iPhone 7. Therefore, the increased adoption of advance packaging technology in portable electronics is expected to propel the demand of wafer level packaging in the years to come.

Wafer level packaging is a cost-effective technology with technological improvements such as lower form factor, smaller thickness, lower pitches, high density of I/O counts, lower power consumption, and higher package density, which makes it an excellent packaging technology for high end electronic gadgets. It is extensively used in portable electronic devices as it enhances the performance and durability of the device, for instance, iPhone 5 has at least 11 different WLPs, the Samsung Galaxy S3 has 6 WLPs and the HTC One X has 7. Continuous research & development activities to develop innovative and improved packaging technology, are in progress which will lead to the growth of the market.

Some of the key players of Wafer Level Packaging Market:

Amkor Technology Inc., Fujitsu Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., Deca Technologies, Qualcomm Inc., Toshiba Corp., Tokyo Electron Ltd., Applied Materials, Inc., ASML Holding NV, and Lam Research Corp.

The Global Wafer Level Packaging Market research report offers an in-depth analysis of the global market, providing relevant information for the new market entrants or well-established players. Some of the key strategies employed by leading key players operating in the market and their impact analysis have been included in this research report.

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What the report features:-

1.Global analysis of Wafer Level Packaging Market from 2014 – 2022 illustrating the progression of the market.

2. Forecast and analysis of Wafer Level Packaging Market by Dosage, Route of Administration and Application from 2014 – 2022.

3.Forecast and analysis of Wafer Level Packaging Market in five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South & Central America.

Reason to Buy:

1.Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the global Wafer Level Packaging Market.
2. Highlights key business priorities in order to assist companies to realign their business strategies.
3. The key findings and recommendations highlight crucial progressive industry trends in the Wafer Level Packaging Market, thereby allowing players to develop effective long term strategies.
4. Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
5. Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it.
6. Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to products, segmentation and industry verticals.

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Posted by on Wednesday May 20 2020, 6:59 PM EDT. All trademarks acknowledged. Filed under Media, Technology, Media, & Telecommunications, Telecommunication. Comments and Trackbacks are open. Follow responses: RSS 2.0

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