Electronic Packaging 2017 Global Market Key Players – BASF, Enfucell, MeadWestvaco, Blue Spark Technologies, Canatu, Cap-XX, Cymbet, Excellatron Solid State – Analysis and Forecast to 2019
Electronic Packaging Market 2017
About Electronic Packaging
Electronic packaging involves the use of engineering and other technologies to incorporate in-built security and protective features in the packaging of products. The use of electronics in packaging is gaining importance as it reduces wastage and enhances safety and security, product differentiation, convenience, brand enhancement, and quality assurance. Printed electronics is the primary technology used, which is expected to reduce the cost of electronic packaging dramatically. Overall, the popularity of electronic packaging is increasing with growing awareness among manufacturers.
TechNavio's analysts forecast the revenue and volume of the Global Electronic Packaging market to grow at a CAGR of 47.02 percent and 46.26 percent, respectively, over the period 2014-2019.
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Covered in this Report
This report covers the present scenario and the growth prospects of the Global Electronic Packaging market for the period 2015-2019. To calculate the market size, the report has taken into consideration the revenue generated by electronic packaging used in the packaging of a number of products. The report includes market segmentation based on type of function and technology used.
The primary functional categories of electronic packaging are:
• Audio/Timer
• Health
• Other CPG
• Scroll/Page Turn
• Status
• Wink/Decal
The Global Electronic Packaging market can also be segmented based on the following technologies:
• EAS
• RFID
This report also presents the vendor landscape and a corresponding detailed analysis of the top five vendors in the market. The vendors include both suppliers and distributors of electronic packaging devices and technologies, primarily those dealing in printed technologies. In addition, the report discusses the major drivers that influence the growth of the market. It also outlines the challenges faced by vendors and the market at large, as well as the key trends that are emerging in the market.
TechNavio's report, Global Electronic Packaging Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, and the APAC and EMEA regions; it also covers the Global Electronic Packaging market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key Regions
• Americas
• APAC
• EMEA
Key Vendors
• BASF
• Enfucell
• MeadWestvaco
• Soligie
• T-Ink
Other Prominent Vendors
• Blue Spark Technologies
• Canatu
• Cap-XX
• Cymbet
• Excellatron Solid State
• Fraunhofer Institute for Electronic Nano Systems
• Front Edge Technology
• Holst Centre
• Infinite Power Solutions
• Infratab
• Kovio
• NEC
• Novalia
• Plastic Logic
• PragmatIC Printing
• Printechnologics
• PST Sensors
• Solarmer Energy
• Thin Film Electronics ASA
Market Driver
• Influence of Consumer Demand on Packaging
• For a full, detailed list, view our report
Market Challenge
• High Cost of Electronic Packaging
• For a full, detailed list, view our report
Market Trend
• Technological Advancements in Printed Electronics
• For a full, detailed list, view our report
Key Questions Answered in this Report
• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
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Table of Contents
- Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
05. Introduction
06. Market Landscape
06.1 Global Electronic Packaging Market Overview
06.1.1 Segmentation of Global Electronic Packaging Market by Function
06.1.2 Segmentation of Global Electronic Packaging Market by Technology
06.1.3 Segmentation of Global Electronic Packaging Market by Geography
07. Global Electronic Packaging Market
07.1 Market Size and Forecast by Revenue
07.2 Market Size and Forecast by Volume
07.3 Five Forces Analysis
08. Market Segmentation by Function
08.1 Global Electronic Packaging Market by Function 2014
08.1.1 Wink/Decal
08.1.2 Audio/Timer
08.1.3 Status
08.1.4 Health
08.1.5 Scroll/Page Turn and Other CPG Segment
08.1.6 Others
09. Market Segmentation by Technology
09.1 Global Electronic Packaging Market by Technology 2014 and 2019
09.1.1 RFID
09.1.2 EAS
09.1.3 Others
10. Geographical Segmentation
10.1 Global Electronic Packaging Market by Geographical Segmentation 2014
11. Buying Criteria
12. Market Growth Drivers
13. Drivers and their Impact
14. Market Challenges
15. Impact of Drivers and Challenges
16. Market Trends
17. Trends and their Impact
18. Vendor Landscape
18.1 Competitive Scenario
18.2 Key Vendor Ranking 2014
18.3 Other Prominent Vendors
19. Key Vendor Analysis
19.1 BASF
19.1.1 Key Facts
19.1.2 Business Overview
19.1.3 Business/Product Segmentation
19.1.4 Business Segmentation by Revenue 2012 and 2013
19.1.5 Geographical Segmentation by Revenue 2013
19.1.6 Business Strategy
19.1.7 Recent Developments
19.1.8 SWOT Analysis
19.2 Enfucell
19.2.1 Key Facts
19.2.2 Business Overview
19.2.3 Recent Developments
19.2.4 SWOT Analysis
19.3 MeadWestvaco
19.3.1 Key Facts
19.3.2 Business Overview
19.3.3 Business Segmentation by Revenue 2013
19.3.4 Business Segmentation by Revenue 2012 and 2013
19.3.5 Geographical Segmentation by Revenue 2013
19.3.6 Recent Developments
19.3.7 SWOT Analysis
19.4 Soligie
19.4.1 Key Facts
19.4.2 Business Overview
19.4.3 Key End Markets
19.4.4 Business Strategy
19.4.5 Recent Developments
19.4.6 SWOT Analysis
19.5 T-Ink
19.5.1 Key Facts
19.5.2 Business Overview
19.5.3 Recent Developments
19.5.4 SWOT Analysis
20. Other Reports in this Series
Continued…….
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Posted by
Vivian Dsena
on Wednesday May 03 2017, 3:30 PM EDT.
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