Electronic Potting & Encapsulating Global Market 2018: Key Players – Henkel, Dow Corning, Hitachi Chemical, LORD Corporation, Huntsman Corporation

Electronic Potting & Encapsulating Industry

Description

Wiseguyreports.Com Adds “Electronic Potting & Encapsulating -Market Demand, Growth, Opportunities and Analysis Of Top Key Player Forecast To 2023” To Its Research Database

This report studies the global Electronic Potting & Encapsulating market status and forecast, categorizes the global Electronic Potting & Encapsulating market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China and other regions (India, Southeast Asia, Central & South America, and Middle East & Africa).

Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.

At present, in the foreign industrial developed countries the Electronic Potting & Encapsulating industry is generally at a more advanced level, the world's large enterprises are mainly concentrated in the Europe and USA. Meanwhile, foreign companies have more mature equipment, strong R & D capability, and the technical level is also in a leading position. But in foreign companies the manufacturing cost is relatively high, compared with in China. So the manufacturing cost in developed countries is a disadvantage. As the production technology of Electronic Potting & Encapsulating manufacturers in China continues to improve, the share of Chinese manufactures will be increasing, and the competitiveness in the international market will also gradually increase.
Currently China has become international Electronic Potting & Encapsulating large consumption country, but the production technology is relatively laggard, the manufacturers can only produce some low-end product, although after 2010 the new production lines is expanding, the technology is still relying on import.

The Electronic Potting & Encapsulating is mainly used in the electronics industry. As the electronics industry develops, there is a growing demand to increase the package performance. Along with this, performance and quality requirements for Electronic Potting & Encapsulatings have become more demanding.
The global Electronic Potting & Encapsulating market is valued at 1170 million US$ in 2017 and will reach 2740 million US$ by the end of 2025, growing at a CAGR of 11.2% during 2018-2025.

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The major manufacturers covered in this report
Henkel 
Dow Corning 
Hitachi Chemical 
LORD Corporation 
Huntsman Corporation 
ITW Engineered Polymers 
3M 
H.B. Fuller 
John C. Dolph 
Master Bond 
ACC Silicones 
Epic Resins 
Plasma Ruggedized Solutions 

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
North America
Europe
China
Japan
Southeast Asia
India
Other Regions (India, Southeast Asia, Central & South America and Middle East & Africa)

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
Silicones
Epoxy
Polyurethane
Others

On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including
Consumer Electronics
Automotive
Medical
Telecommunications
Others

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Table of Contents

Global Electronic Potting & Encapsulating Market Research Report 2018
1 Electronic Potting & Encapsulating Market Overview
1.1 Product Overview and Scope of Electronic Potting & Encapsulating
1.2 Electronic Potting & Encapsulating Segment by Type (Product Category)
1.2.1 Global Electronic Potting & Encapsulating Production and CAGR (%) Comparison by Type (Product Category)(2013-2025)
1.2.2 Global Electronic Potting & Encapsulating Production Market Share by Type (Product Category) in 2017
1.2.3 Silicones
1.2.4 Epoxy
1.2.5 Polyurethane
1.2.6 Others
1.3 Global Electronic Potting & Encapsulating Segment by Application
1.3.1 Electronic Potting & Encapsulating Consumption (Sales) Comparison by Application (2013-2025)
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Medical
1.3.5 Telecommunications
1.3.6 Others
1.4 Global Electronic Potting & Encapsulating Market by Region (2013-2025)
1.4.1 Global Electronic Potting & Encapsulating Market Size (Value) and CAGR (%) Comparison by Region (2013-2025)
1.4.2 Status and Prospect (2013-2025)
1.4.3 27 Status and Prospect (2013-2025)
1.4.4 North America Status and Prospect (2013-2025)
1.4.5 Europe Status and Prospect (2013-2025)
1.4.6 China Status and Prospect (2013-2025)
1.4.7 Japan Status and Prospect (2013-2025)
1.5 Global Market Size (Value) of Electronic Potting & Encapsulating (2013-2025)
1.5.1 Global Electronic Potting & Encapsulating Revenue Status and Outlook (2013-2025)
1.5.2 Global Electronic Potting & Encapsulating Capacity, Production Status and Outlook (2013-2025)

....

7 Global Electronic Potting & Encapsulating Manufacturers Profiles/Analysis
7.1 Henkel
7.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.1.2 Electronic Potting & Encapsulating Product Category, Application and Specification
7.1.2.1 Product A
7.1.2.2 Product B
7.1.3 Henkel Electronic Potting & Encapsulating Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
7.1.4 Main Business/Business Overview
7.2 Dow Corning
7.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.2.2 Electronic Potting & Encapsulating Product Category, Application and Specification
7.2.2.1 Product A
7.2.2.2 Product B
7.2.3 Dow Corning Electronic Potting & Encapsulating Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
7.2.4 Main Business/Business Overview
7.3 Hitachi Chemical
7.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.3.2 Electronic Potting & Encapsulating Product Category, Application and Specification
7.3.2.1 Product A
7.3.2.2 Product B
7.3.3 Hitachi Chemical Electronic Potting & Encapsulating Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
7.3.4 Main Business/Business Overview
7.4 LORD Corporation
7.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.4.2 Electronic Potting & Encapsulating Product Category, Application and Specification
7.4.2.1 Product A
7.4.2.2 Product B
7.4.3 LORD Corporation Electronic Potting & Encapsulating Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
7.4.4 Main Business/Business Overview
7.5 Huntsman Corporation
7.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.5.2 Electronic Potting & Encapsulating Product Category, Application and Specification
7.5.2.1 Product A
7.5.2.2 Product B
7.5.3 Huntsman Corporation Electronic Potting & Encapsulating Capacity, Production, Revenue, Price and Gross Margin (2015-2018)
7.5.4 Main Business/Business Overview
7.6 ITW Engineered Polymers
7.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.6.2 Electronic Potting & Encapsulating Product Category, Application and Specification
7.6.2.1 Product A
7.6.2.2 Product B
7.6.3 ITW Engineered Polymers Electronic Potting & Encapsulating Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
7.6.4 Main Business/Business Overview
7.7 3M
7.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.7.2 Electronic Potting & Encapsulating Product Category, Application and Specification
7.7.2.1 Product A
7.7.2.2 Product B
7.7.3 3M Electronic Potting & Encapsulating Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
7.7.4 Main Business/Business Overview
7.8 H.B. Fuller
7.8.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.8.2 Electronic Potting & Encapsulating Product Category, Application and Specification
7.8.2.1 Product A
7.8.2.2 Product B
7.8.3 H.B. Fuller Electronic Potting & Encapsulating Capacity, Production, Revenue, Price and Gross Margin (2013-2018)
7.8.4 Main Business/Business Overview
7.9 John C. Dolph
7.9.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.9.2 Electronic Potting & Encapsulating Product Category, Application and Specification
7.9.2.1 Product A
7.9.2.2 Product B
7.9.3 John C. Dolph Electronic Potting & Encapsulating Capacity, Production, Revenue, Price and Gross Margin (2013-2020)
7.9.4 Main Business/Business Overview
7.10 Master Bond
7.10.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.10.2 Electronic Potting & Encapsulating Product Category, Application and Specification
7.10.2.1 Product A
7.10.2.2 Product B
7.10.3 Master Bond Electronic Potting & Encapsulating Capacity, Production, Revenue, Price and Gross Margin (2013-2020)
7.10.4 Main Business/Business Overview
7.11 ACC Silicones
7.12 Epic Resins
7.13 Plasma Ruggedized Solutions

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Posted by Vivian Dsena on Wednesday June 20 2018, 9:15 AM EST. All trademarks acknowledged. Filed under Uncategorized. Comments and Trackbacks closed. Follow responses: RSS 2.0